Dissipating heat using a heat conduit
US6760222B1 · kind B1 · utility
13Cited by
6References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 21, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | May 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus has an elongated heat conduit (such as a heat pipe) in thermal communication with a heat spreader for thermally contacting a heat-generating device. The heat spreader has a phase-change mechanism to spread heat within the heat spreader. In one implementation, the phase-change mechanism includes paths for heated vapor flow and cooled liquid flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.