Multilayer ceramic electronic component and manufacturing method thereof
US6760227B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2003 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Feb 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.