Headset and method of manufacturing headsets that utilize a single transceiver form-factor design with a number of different housing styles
US6760458B1 · kind B1 · utility
24Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2000 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/05
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A headset and a method of manufacturing headsets are disclosed where a single transceiver form-factor design is utilized with a number of styles of housings. By utilizing the same transceiver with the different styles of housings, manufacturing costs are reduced while at the same time providing a wider variety of choices to the consumer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.