Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
US6760981B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 18, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Jan 18, 2022 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B21/004
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention provides a compact drying chamber for drying printed circuit boards and electronic connectors and components mounted thereto by enhanced evaporation to remove residual water and completely dry printed circuit boards. The compact drying chamber comprises features that help maximize a velocity at which heated air impacts printed circuit boards to significantly enhance evaporation from surfaces of printed circuit boards and to raise the temperature of electronic connectors and components to allow evaporation therefrom, while maintaining low power consumption with respect to heating and circulating air. The compact drying chamber also comprises features that help maximize a dwell time of printed circuit boards in high velocity heated air within practical conveyance speeds, while maintaining overall dimensions that allow a compact design. The compact drying chamber further comprises features that recirculate air, minimize heat loss, minimize exhaust requirements and keep manufacturing and operation costs low.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.