Proportional micromechanical device
US6761420B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 18, 2001 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Dec 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0396
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
The present invention provides a proportional microvalve having a first, second and third layer, and having high aspect ratio geometries. The first layer defines a cavity with inlet and outlet ports. The second layer, doped to have a low resistivity and bonded between the first and third layers, defines a cavity having a flow area to permit fluid flow between the inlet and outlet ports. The second layer further defines an actuatable displaceable member, and one or more thermal actuators for actuating the displaceable member to a position between and including an open and a closed position to permit or occlude fluid flow. The third layer provides one wall of the cavity and provides electrical contacts for electrically heating the thermally expandable actuators. The thermal actuators and the displaceable member have high aspect ratios and are formed by deep reactive ion etching such that they are displaceable in the plane of the second layer while being very stiff out of the plane. Thus, both actuation and displacement of the displaceable member are in the plane of the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.