Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void
US6761829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.