Electroless process for treating metallic surfaces and products formed thereby
US6761934B2 · kind B2 · utility
4Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Aug 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/29
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electroless process to deposit a silicate containing coating or film upon a metallic or conductive surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.