Polyamide and conductive filler adhesive

US6761978B2 · kind B2 · utility

Assignee

• Xerox Corporation · US

Inventors

• Ralph A. Mosher · Rochester, US
• T. Edwin Freeman · Woodstock, US
• Theodore Lovallo · Williamson, US
• Damodar M. Pai · Fairport, US
• John F. Yanus · Webster, US
• Timothy J. Fuller · Pittsford, US
• Markus R. Silvestri · Fairport, US
• Gerald M. Fletcher · Pittsford, US
• Antonio DeCrescentis · Rochester, US
• Ihor W. Tarnawskyj · Webster, US

Key dates

• Filing date: Apr 11, 2001
• Grant date: Jul 13, 2004
• Expiry date: Oct 2, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31725
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

An adhesive having polyamide and an electrically conductive filler dispersed or contained therein, for use in bonding components of electrostatographic, contact electrostatic, digital and other like printing machines.