Method for manufacturing light-emitting element on non-transparent substrate
US6762069B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Dec 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/835
Abstract
A method for manufacturing light-emitting device on non-transparent substrate includes the steps of forming a semiconductor epitaxial layer, a first conductive layer, a reflecting layer and a first conduction layer on a first substrate, and forming second conduction layer on a second substrate. Afterward, the first conduction layer and the second conduction layer is bounded by thermal pressing. The first substrate is then removed and a second conductive layer is formed to complete a light-emitting device. The light-emitting device can be incorporated with wetting layer and blocking layer to prevent inner diffusion and enhance external quantum efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.