Low stress integrated circuit copper interconnect structures
US6762501B1 · kind B1 · utility
4Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2003 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Apr 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Isolated metal structures (110), (140) are formed adjacent to terminated metal lines (100), (130) that are connect by a via (120). The isolated structures (110), (140) act to suppress the stress created in the terminated metal lines (100), (130) during thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.