Flexible integrated monolithic circuit

US6762510B2 · kind B2 · utility

Assignee

• KONINKLIJKE PHILIPS ELECTRONICS NV · NL

Inventors

• Johann-Heinrich Fock · Hamburg, DE
• Wolfgang Schnitt · Hamburg, DE
• Hauke Pohlmann · Seevetal, DE
• Andreas Gakis · Hamburg, DE
• Michael Burnus · Buxtehude, DE
• Martin Schaefer · Gebenstorf, CH
• Henricus Godefridus Rafael Maas · Eindhoven, NL
• Theodorus Martinus Michielsen · Eindhoven, NL
• Ronald Dekker · Valkenswaard, NL

Key dates

• Filing date: May 8, 2002
• Grant date: Jul 13, 2004
• Expiry date: May 8, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12044
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A flexible monolithic integrated circuit which is essentially formed from flexible circuit elements, connecting elements between the flexible circuit elements, and a flexible coating which comprises at least one layer of a coating material comprising a polymer, is suitable as a small and convenient integrated circuit for electronic devices on flexible data carriers for the logistic tracking of objects and persons.The invention also relates to a method of manufacturing a flexible integrated monolithic circuit whereby integrated monolithic circuit elements and connecting elements are formed in and on a semiconductor substrate, the main surface of the integrated circuit elements facing away from the semiconductor substrate are coated with a polymer resin, and the semiconductor substrate is removed. The method is based on conventional process steps in semiconductor technology and leads to a flexible integrated monolithic circuit in a small number of process steps.