Method and apparatus for securing an electrically conductive interconnect through a metallic substrate
US6763580B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Mar 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and module for securing a conductive interconnect (30) through a metallic substrate (36). The method includes the steps of: forming a hole (34) in the metallic substrate (36), the hole (34) defined by an internal surface (46) of the metallic substrate (36); applying an electrically insulating layer (48) to the metallic substrate (36) including the internal surface (46); applying a solderable coating (50) to at least a portion of the electrically insulating layer (48) around the hole (34); applying a solder (52) to at least a portion of the solderable coating (50) at and above the hole (34); inserting the conductive interconnect (30) through the hole (34); and solder bonding the conductive interconnect (30) within the hole (34).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.