Mold temperature control for casting system
US6763879B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Jul 1, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D18/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold temperature control system comprises a mold section having a cavity, a fluid circuit to distribute a flow of a conditioning fluid, the fluid circuit being positioned spaced apart from the cavity, a temperature sensor positioned in the mold to generate a signal representative of a temperature in the mold, a controllable supply of the conditioning fluid, and a controller for automatically initiating flow of the conditioning fluid through the fluid circuit in response to an initiation temperature and for automatically terminating flow of the conditioning fluid through the fluid circuit in response to a termination temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.