Fluid ejection device and method of manufacturing a fluid ejection device
US6764165B2 · kind B2 · utility
3Cited by
10References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Sep 30, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1637
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.