High-pressure pad cleaning system
US6764388B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Aug 18, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A high-pressure pad cleaning system that can be used in conjunction with semiconductor device fabrication tools that utilize pads, such as chemical-mechanical polishing (CMP) tools, is disclosed. A system includes a turntable, first and second outlets, and a dresser. A pad is placed on the turntable, where the turntable rotates in a first direction. The first outlet supplies a dressing solution, such as deionized water, onto the pad at a first pressure, substantially at a single point on the center of the pad. The second outlet supplies the solution onto the pad at a second pressure greater than the first pressure, substantially at a radial line from the center of the pad to its edge at an angle and in a direction opposite to the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.