Copper-nickel-silicon two phase quench substrate
US6764556B2 · kind B2 · utility
2Cited by
8References
9Claims
0Family size
Inventors
Key dates
| Filing date | May 17, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Nov 6, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.