Adhesive system for form reversible glued joints
US6764569B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 29, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Mar 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive system for forming reversible adhesive bonds includes at least one polymeric adhesive component comprising at least one of polyurethanes, polyureas, or epoxy resins and at least one additional component that includes a functional group that can be activated by the introduction of energy, such that a chemical reaction with the adhesive component takes place involving a partial breakdown of the adhesive component. Reversible bonding of articles and controlled parting of an adhesive bond between articles can be achieved with the adhesive system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.