CO2-processes photoresists, polymers, and photoactive compounds for microlithography
US6764809B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 10, 2001 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Feb 13, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/126
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process of forming a resist image in a microelectronic substrate comprises the steps of contacting the substrate with a composition first comprising carbon dioxide and a component selected from the group consisting of at least one polymeric precursor, at least one monomer, at least one polymeric material, and mixtures thereof to deposit the component on the substrate and form a coating thereon; then imagewise exposing the coating to radiation such that exposed and unexposed coating portions are formed; then subjecting the coating to a second composition comprising carbon dioxide having such that either one of the exposed or the unexposed coating portions are removed from the substrate and the other coating portion is developed and remains on the coating to form an image thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.