Composition of aromatic polyepisulfide,polyglycidyl ether and/or ester, and acid anhydride
US6765071B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G75/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a resin composition containing an aromatic episulfide which exhibits excellent moldability, heat resistance and optical properties. The composition comprises an aromatic episulfide compound (A) having two or more reactive groups represented by the following formula (1) (wherein X is O or S with S accounting for 50 mol % or more of X on the average and R1-R4 are independently hydrogen, halogen or an alkyl group with 1-4 carbon atoms) in its molecule, a glycidyl compound (B) composed of an aromatic glycidyl ether compound having two or more glycidyl groups in its molecule or a glycidyl ester compound having two or more glycidyl groups in its molecule, an acid anhydride (C) and a curing catalyst (D) as essential components and shows the following molar ratios of &bgr;-epithiopropyl group (a), glycidyl group (b) and acid anhdyride group (c); [(b)+(a)]/(c)=1.35-3.5, (a)/(c)=0.5-2.2 and (b)/(c)=0.5-1.9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.