Apparatus for treating materials by means of a laser beam
US6765176B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | May 29, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device (1) for machining materials by means of a laser beam (2) comprises a lens arrangement (4) through which passes the light emitted by a laser source. Said lens arrangement (4) is tilted relative to the optical axis (5) and arranged eccentrically in order to change the cross-sectional area of the laser beam (2), particularly from an elliptical to a circular geometry, and at the same time to compensate an inclination angle of the laser beam passing through the lens arrangement in relation to the optical axis. This makes it possible to ensure the quality of the cut surface through essentially corresponding entry and exit cross-sectional areas of the laser beam (2) on the material, without the laser beam (2) having to be circularly polarized for this purpose. The costs for producing the device (1) can thereby be kept comparatively low.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.