Semiconductor integrated circuit device
US6765286B1 · kind B1 · utility
2Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor circuit chip bonded onto the substrate and having an electrode connected to the circuit pattern, a reinforcement metal plate, and a seal resin portion for covering a peripheral face of the semiconductor integrated circuit chip and sticking the reinforcement metal plate onto the semiconductor integrated circuit chip is mounted within a card substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.