Semiconductor device and the method for manufacturing the same
US6765299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2001 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Mar 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first semiconductor chip having a plurality of pads, a second semiconductor chip having a plurality of pads, the second semiconductor chip being fixed over a main surface of the first semiconductor chip, an insulating layer formed between the first semiconductor chip and the second semiconductor chip a plurality of conductive posts formed over the main surface of the first semiconductor chip and a main surface of the second semiconductor chip, the plurality of conductive posts being electrically connected to the plurality of pads on the first semiconductor chip and the plurality of pads on the second semiconductor chip and a resin covering the main surfaces of the first and second semiconductor chips, the resin partially covering the plurality of conductive posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.