System and method for mounting components using ball and socket structure
US6765733B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Oct 23, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/003
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed are systems and methods providing adjustable mounting with multiple degrees of freedom, such as three degrees of freedom allowing controlled adjustment of pitch, roll, and/or yaw. In providing such degrees of freedom, a ball member of a ball and socket mounting apparatus may preferably be disposed upon a surface and a mount, having a socket portion sized and shaped to correspond to a mating surface of the ball member, may be placed in communication therewith. The mount may have a component to be mounted placed thereon after the mount is placed in communication with the ball member. Preferably as part of the system manufacturing process, an adjustment mechanism is placed in communication with the mount and provides manipulating forces thereto, preferably causing the socket portion of the mount to slidably engage the mating surface of the ball member, in order to precisely position a component mounted thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.