Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
US6765798B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2003 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Jun 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management device is for a electronic apparatus, and includes a thermally conductive member, and elastic and thermally conductive material. The member is for engagement with a heat sinking portion and for conducting thermal energy. The member has two legs that are deflectable relative to each other. The first leg is configured for location proximate to an electronic component and the second leg is configured to extend toward the heat sinking portion. The member has a connecting portion interconnecting the two legs such that thermal energy can travel between the legs, and such that a spacing is provided between the two legs. The elastic and thermally conductive material is located in the spacing between the legs such that the thermal energy can travel from the first leg through the material and to the second leg, and such that the two legs may deflect relative to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.