Composition with EMC shielding characteristics
US6765806B1 · kind B1 · utility
2Cited by
18References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 12, 2001 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Jun 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a composition with electromagnetic compatibility (EMC) characteristics. In an aspect of the present invention, an adhesive suitable to provide a bond between components may include an adhering material suitable for holding a first surface and a second surface in contact. A plurality of items is disposed in the adhering material. The plurality of items has electromagnetic capability shielding characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.