Automated monitoring system, virtual oven and method for stress testing logically grouped modules
US6766267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2001 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Mar 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S707/99945
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A virtual oven efficiently conducts stress testing of large numbers of modules. The virtual oven includes a logical grouping of modules, a controller, test instruments and a database which are all connected via a network. The logical groupings of modules of several virtual ovens may be physically accommodated within a single environmental stress screening room. Switching between modules in a logical group permits a single test piece of test equipment to be time-shared among the modules in the logical group. The method of bum-in testing a logical group of modules rotates a test sequence, including passive and active test cycles, between the modules. A test signal is split and supplied to multiple modules. Passive testing may be performed by monitoring parameters of the module while the test signal is supplied to the module. Active testing may be a functional test of the module in which the test signal is supplied to, processed by, and output from the module. Such test signals output from the modules are switched to the test equipment on a time-share basis. In this way, the number or expensive test equipment set-ups may reduced. The controller for each virtual oven also generates dis…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.