Lightweight semiconductor device and method for its manufacture
US6767762B2 · kind B2 · utility
22Cited by
6References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 23, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Jul 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultra lightweight semiconductor device comprises a substrate electrode, a body of semiconductor material, and a top electrode, and is manufactured by a process wherein the thickness dimension of a portion of the substrate electrode is decreased so as to reduce the weight of the device. The portions of the device having a thick substrate serve to support and reinforce the device during processing and handling. These portions may subsequently be severed away to further reduce the weight of the device. Also disclosed are configurations of ultra lightweight semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.