In situ liner barrier
US6767832B1 · kind B1 · utility
1Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Sep 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76843
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a substrate, where the substrate is transferred from an ambient environment into a clean environment. The substrate is heated to at least a first temperature within the clean environment, and then maintained at no less than the first temperature within the clean environment. The substrate is selectively transferred within the clean environment to more than one processing chambers, and processed in the more than one processing chambers. The substrate is transferred from the clean environment into the ambient environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.