Reflow soldering apparatus and method for selective infrared heating
US6768083B2 · kind B2 · utility
6Cited by
20References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Sep 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.