Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap
US6768628B2 · kind B2 · utility
35Cited by
70References
80Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS structure is provided having a cap that encapsulates and protects the fragile components of the device, while having an electrical trace embedded in a nonconductive substrate. The electrical trace includes a first terminal end that is exposed to the peripheral region of the device, and a second end that is connected to the MEMS structure to facilitate operation of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.