Patent · US Expired

Triangular assignment of pins used for diagonal interconnections between diagonal chips in a multi-chip module

US6769108B2 · kind B2 · utility

8Cited by
7References
4Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 14, 2002
Grant dateJul 27, 2004
Priority date
Expiry dateJun 19, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2113/18
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

A system for minimizing the length of the longest diagonal interconnection. A multiple chip module may comprise a first chip connected to a second chip located diagonally to the first chip. The first and second chip are interconnected by one or more interconnections commonly referred to as diagonal interconnections. Since the one or more diagonal interconnections between the first chip and the second chip are interconnected between a set of pins on each chip that form a triangular pattern, the longest diagonal interconnection is substantially the same length as the length of the longest orthogonal interconnection. Furthermore, since the one or more diagonal interconnections between the first chip and the second chip are interconnected between a set of pins on each chip that form a triangular pattern, the longest diagonal interconnection is substantially the same length as the length of the second longest diagonal interconnection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.