Package including a lidstock laminate
US6769227B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jul 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1379
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming a package by heat sealing a trap-printed laminate to a support member (e.g., tray). The laminate has a free shrink in each of the transverse and machine directions of at least about 10% at 200° F. and at least about 21% at 240° F. The laminate has an oxygen transmission rate of no more than about 100 cubic centimeters. The outside layer of the laminate comprises at least about 40% of one or more relatively high-melt polymers each having a melting point at least about 25° F. higher than the lowest melting point polymer of the sealant layer. The first film has an oxygen transmission rate greater than the oxygen transmission rate of the second film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.