Device for monitoring force and pressure in injection molding machines
US6769897B2 · kind B2 · utility
2Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jan 29, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76478
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Device for monitoring force and pressure in injection molding machines, with at least one sensor for measuring the deformation of a machine part that is deformed by the closing or injection pressure, wherein a supporting body (2) is provided that relieves the machine part (3) monitored by the sensor (1) as soon as the closing or injection pressure exceeds a certain value that is less than half its maximum value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.