Part fabricating method
US6770188B2 · kind B2 · utility
5Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Feb 1, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H9/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A structural body material layer is formed directly on a base substrate or via a sacrificing layer or a peeling layer, a groove is fabricated electrochemically along an outer configuration shape of a part constituting an object at the structural body material layer and thereafter, only the sacrificing layer or the base substrate is selectively removed or the part is mechanically separated from the peeling layer to thereby separate the part and the base substrate and provide the part constituting the object or fabricate a part having a movable portion by partially restricting a portion to be separated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.