Method for localized preform cooling outside the mold
US6770239B2 · kind B2 · utility
6Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Oct 23, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for providing targeted cooling to a pre-molded article, such as a preform. A cooling pin is inserted into the preform such that it makes contact with targeted area, such as the mold gate area. This permits conductive cooling of the targeted area. The apparatus and method are particularly suited to post-mold cooling in conjunction with a robotic take-out plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.