Adhesive material for programmable device
US6770531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jul 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B63/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an aspect, an apparatus is provided that sets and reprograms the state of programmable devices. In an aspect, a method is provided such that an adhesive is formed on a dielectric and on an electrode, the adhesive is patterned exposing the electrode, and a programmable material is formed on the adhesive and on the electrode. In an aspect, a method is provided such that an adhesive is formed on a dielectric, an opening is formed through the dielectric exposing a contact formed on a substrate, and a programmable material is formed on the adhesive and on a portion of the contact. A conductor is formed on the programmable material and the contact transmits to a signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.