Substrate cutting method
US6770544B2 · kind B2 · utility
110Cited by
9References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Feb 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate, such as a semiconductor wafer, is cut without using a dicer or an adhesive sheet.A semiconductor wafer 1 formed with a number of elements 2 is drawn and held by an x-y table 4, and ultrashort pulse laser 7 having a pulse width of not more than 1 picosecond is irradiated along scribed lines between the elements 2 to cut the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.