Laser processing apparatus and method
US6770843B2 · kind B2 · utility
4Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an f&thgr; lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.