Perimeter seal for backside cooling of substrates
US6771482B2 · kind B2 · utility
10Cited by
27References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Aug 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, typically a sealing member extending around the periphery of a substrate support or chuck, seals an individual substrate with respect to a substrate support, typically in a processing chamber. The seal is of a corrugated shape, that enhances clamping forces, typically from electrostatic or mechanical clamps, to provide a seal between it and the substrate, for example a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.