Power module for multi-chip printed circuit boards
US6771507B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2003 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jan 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.