Method of machining glass substrate and method fabricating high-frequency circuit
US6772514B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2001 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Feb 7, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.