Polishing composition and polishing method employing it
US6773476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Aug 21, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising:(a) at least one abrasive selected from the group consisting of silicon dioxide and aluminum oxide,(b) at least one organic compound selected from the group consisting of a polyethylene oxide, a polypropylene oxide, a polyoxyethylene alkyl ether, a polyoxypropylene alkyl ether, a polyoxyethylenepolyoxypropylene alkyl ether and a polyoxyalkylene addition polymer having a C≡C triple bond, represented by the formula (1): wherein each of R1 to R6 is H or a C1-10 alkyl group, each of X and Y is an ethyleneoxy group or a propyleneoxy group, and each of m and n is a positive number of from 1 to 20,(c) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, &agr;-alanine and histidine,(d) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole,(e) hydrogen peroxide, and(f) water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.