Article and method for controlled debonding of elements using shape memory alloy actuators
US6773535B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 3, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Mar 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12507
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A separable bonding system including two opposed rigid adherends and a deformed shape memory alloy element disposed between and adhesively bonded to facing surfaces of the two rigid adherends. A method of adhesively bonding and selectively debonding and separating at least two rigid adherends including mechanically straining a shape memory alloy element to form a deformed shape memory alloy element; disposing the deformed shape memory alloy element between and adhesively bonding the deformed shape memory alloy element to facing surfaces of at least two rigid adherends; elevating the temperature of the deformed shape memory alloy element sufficient to transform the deformed shape memory alloy element from the mechanically strained state to a recovered shape, thereby weakening adhesive bonds formed between the shape memory alloy element and separating the facing surfaces of the at least two rigid adherends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.