Method and apparatus for the multiplexed acquisition of a bare die from a wafer
US6773543B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 6, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | May 6, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the co-processing of bare die removal from a semiconductor wafer for the improved throughput of the extraction of die from a wafer for subsequent placement onto a substrate. The apparatus includes a pick head containing a nozzle having a suction port within that secures the bare die as it is removed from the wafer. The intermediate holding station has a plurality of nozzles, each having a vacuum port to secure and buffer a multitude of flipped die that are transferred from the pick nozzle. Vacuum flow valves enable the release and transfer of the bare die. Having a multiple of nozzles provides a buffer for the die as they are subsequently transitioned from the pick nozzle, queued within the intermediate transfer station and loaded in tandem onto a die shuttle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.