Metal alloy compositions and plating methods related thereto
US6773568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.