Coating for silver plated circuits
US6773757B1 · kind B1 · utility
18Cited by
18References
10Claims
0Family size
Inventors
Key dates
| Filing date | Apr 14, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Apr 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0769
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.