Silicon target assembly
US6774009B1 · kind B1 · utility
5Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jun 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3491
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A target-backing plate assembly for use in physical vapor deposition (PVD) processes. The lower curved surface of the target of the assembly is received in a conformingly-shaped backing plate, while a planar upper surface is presented for PVD. The shape of the target increases the amount of material dissipated and the quality of the film and reduces the amount of necessary machining in production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.