Patent · US Expired

Method and apparatus for forming a curved polyline on a radiation-sensitive resist

US6774375B2 · kind B2 · utility

3Cited by
4References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 5, 2001
Grant dateAug 10, 2004
Priority date
Expiry dateMar 13, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/31761
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

In a method for forming, with the aid of an electron beam (6), a polyline on a substrate (4) coated with a radiation-sensitive resist, the electron beam (6) is directed onto a surface of the substrate (4) in the direction of a Z coordinate, and the substrate (4) is displaced relative to the electron beam (6) in an X-Y plane in individual steps. After each individual step of the displacement, the electron beam (6) acts with a predefined energy input on the substrate (4) during a halt in the displacement motion. The energy input for each individual step is determined as a function of the shape of the polyline ascertained from several preceding individual steps. Also described is a corresponding apparatus with which, using electron beam lithography, it is possible to form polylines with a very uniform line width. The method and apparatus are particularly suitable for writing curved polylines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.