Semiconductor chip module
US6774473B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip module includes a chip-mounting member having opposite first and second surfaces, a set of circuit traces, and a plurality of plated through holes that extend through the first and second surfaces and that are connected to the circuit traces. A dielectric tape member bonds adhesively a semiconductor chip on the chip-mounting member. A first conductor unit connects electrically contact pads on a pad mounting surface of the semiconductor chip and the circuit traces. A plurality of solder balls are disposed on one of the first and second surfaces of the chip-mounting member, are aligned with and are connected to the plated through holes in the chip-mounting member, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.