RF package with multi-layer substrate having coplanar feed through and connection interface
US6774748B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2000 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jan 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF package includes a multilayered dielectric substrate, a feed-through, and metal members. First and second dielectric substrates are formed on the multilayered dielectric substrate. The multilayered dielectric substrate has a cavity where a semiconductor element is to be mounted. The feed-through connects the inside and outside of the cavity and is comprised of a coplanar line formed on the first dielectric substrate and an inner layer line obtained by forming the second dielectric substrate on the coplanar line. The coplanar line and the inner layer line share a strip-like signal conductor. The metal members are formed at a connection interface between the coplanar line and the inner layer line on two sides of the signal conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.